Capabilites of DME USA INC.
| Preferred Materials | |
|---|---|
| FR4 Standard Tg | Shengyi, ITEQ, KB, Nanya,Ventec |
| FR4 Mid Tg (Lead Free< Compatible) | Shengyi S1000H, ITEQ IT158 |
| FR4 High Tg (Lead Free Compatible) | Shengyi S1000-2M, S1170, EMC EM827 ,Isola 370HR, ITEQ IT180A,Panasonic R1755V |
| High Performance Low Loss FR4 | EMC EM828, EM888(S), EM888(K), Isola FR408, FR408HR Isola I-Speed, I-Tera MT , Nelco N4000-13EP, EPSI< Panasonic R5775 Megtron 6 |
| RF Materials | Rogers RO4350, RO3010 , Taconic RF-30, RF-35, TLC, TLX, TLY Taconic 601, 602, 603, 605 |
| Halogen Free | EMC EM285, EM370(D), Panasonic R1566 |
| Aluminum Backed PCB | Shengyi SAR20, Yugu YGA |
| Additional Materials |
|---|
| Rigid Polyimide: Shengyi SH260, Ventec VT901 |
| BT Epoxy: Nelco and Mitsubishi |
| High CTI FR4: Shengyi S1600 |
| Flexible Circuit Materials: Dupont, Panasonic, Taiflex, Shengyi |
| Surface Finishes |
|---|
| Electroless Nickel Immersion Gold (ENIG) |
| Hot Air Solder Level (HASL, Lead and Lead?free) |
| OSP, Immersion Tin,Immersion Silver, ENEPIG |
| Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
| Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM |
| PCB Technologies | Standard | Advanced |
|---|---|---|
| Rigid-Flex & Flexible Circuits | Y | Y |
| Buried and Blind Vias | Y | Y |
| Sequential Lamination | Y | Y |
| Impedance Control | ± 10% | ± 5% |
| Hybrids & Mixed Dielectrics | Y | Y |
| Aluminum PCB's | Y | Y |
| Non-Conductive Via Fill (VIP) | Y | Y |
| Conductive Via Fill | Y | Y |
| Cavity Boards | Y | Y |
| Backdrilling | Y | Y |
| Controlled Depth Drill and Rout | Y | Y |
| Edge Plating | Y | Y |
| Buried Capacitance | Y | Y |
| Etch Back | Y | Y |
| In-board Beveling | Y | Y |
| 2-D Bar Code Printing | Y | Y |
| Standard Features | Standard | Advanced |
|---|---|---|
| Maximum Layer Count | 28 | 40 |
| Maximum Panel Size | 533x610mm [21x24"] | 610x1067mm [24x42"] |
| Outer Layer Trace/Spacing (1/3oz starting foil + platig) | <90µm/90µm [0.0035"/0.0035"] | 64µm/76µm [0.0025"/0.003"] |
| Inner Layer Trace/Spacing (Hoz inner layer cu) | 76µm/76µm [0.003"/0.003"] | 50µm/50µm [0.002"/0.002"] |
| Maximum PCB Thickness | 3.2mm [0.125"] | 6.5mm [0.256"] |
| Minimum PCB Thickness | 0.20mm [0.008"] | 0.10mm [0.004"] |
| Minimum Mechancial Drill Size | 0.20mm [0.008"] | 0.10mm [0.004"] |
| Minimum Laser Drill Size | 0.10mm [0.004"] | 0.08mm [0.003"] |
| Maximum PCB Aspect Ratio | 12:1 | 40:1 |
| Maximum Copper Weight | 5 oz [178µm] | 6 oz [214µm] |
| Minimum Copper Weight | 1/3 oz [12µm] | 1/4 oz [9µm] |
| Minimum Core Thickness | 50µm [0.002"] | 38µm [0.0015"] |
| Minimum Dielectric Thickness | 64µm [0.0025"] | 38µm [0.0015"] |
| Minimum Pad Size Over Drill | 0.46mm [0.018"] | 0.4mm [0.016"] |
| Solder Mask Registration | ± 50µm [0.002"] | ± 38µm [0.0015"] |
| Minimum Solder Mask Dam | 76µm [0.003"] | 64µm [0.0025"] |
| Copper Feature to Edge, V?cut (30°) | 0.40mm [0.016"] | 0.36mm [0.014"] |
| Copper Feature to PCB Edge, Routed | 0.25mm [0.010"] | 0.20mm [0.008"] |
| Tolerance on Overall Dimensions | ± 100µm [0.004"] | ±50µm [0.002"] |
| HDI Features | Standard | Advanced |
|---|---|---|
| Minimum Microvia Hole Size | 100µm [0.004"] | 75µm [0.003"] |
| Capture Pad Size | 0.25mm [0.010"] | 0.20mm [0.008"] |
| Glass Reinforced Dielectrics | Y | Y |
| Maximum Aspect Ratio | 0.7:1 | 1:1 |
| Stacked Microvias | Y | Y |
| Copper Filled Microvias | Y | Y |
| Buried Filled Vias | Y | Y |
| Maximum No. of Buildup Layers | 5+N+5 | Y |
| Advanced Processes |
|---|
| Direct Imaging for Innerlayers, Outerlayers, and Soldermask |
| Direct Plating for High Layer Count and Microvias Products |
| Reverse Pulse Plating |
| Solid Copper Plated PTH Vias |
| XACT Tooling System for Improved Layer-to-Layer Registration |
| Spray Coating for Soldermask |
| Inkjet Printing for Legend |
| In-Line AOI for Outerlayers and AOI for Final Inspection |
| ORMET® Copper Paste for Any-layer Connections |
| ZETA® Material for HDI and Low-Loss Applications |
| Quality System and Certifications |
|---|
| IPC Specs: IPC-A-600, IPC-6012(Rigid board), IPC-6013(Flex board), IPC-6016(HDI) IPC-6018(High frequency) (Class II and Class III) |
| Quality System Certifications: ISO 9001, IATF16949, ISO13485 |
| Environmental Certifications: ISO14001, ISO/TS14067 |
| UL Certification: File number E332056 |
