Email: usa@dmele.com
    Tel: +1 (847) 802-0731

Our five promises

[1] High Quality, Low Prices
[2] Directly from Shenzhen/China
[3] Flex and Rigid-Flex
[4] PCBA in-house
[5] Instant quotes online

Preferred Materials
FR4 Standard TgShengyi, ITEQ, KB, Nanya,Ventec
FR4 Mid Tg (Lead Free< Compatible)Shengyi S1000H, ITEQ IT158
FR4 High Tg (Lead Free Compatible)Shengyi S1000-2M, S1170, EMC EM827 ,Isola 370HR, ITEQ IT180A,Panasonic R1755V
High Performance Low Loss FR4EMC EM828, EM888(S), EM888(K), Isola FR408, FR408HR Isola I-Speed, I-Tera MT , Nelco N4000-13EP, EPSI< Panasonic R5775 Megtron 6
RF MaterialsRogers RO4350, RO3010 , Taconic RF-30, RF-35, TLC, TLX, TLY Taconic 601, 602, 603, 605
Halogen FreeEMC EM285, EM370(D),
Panasonic R1566
Aluminum Backed PCBShengyi SAR20, Yugu YGA
Additional Materials
 Rigid Polyimide:  Shengyi SH260, Ventec VT901
 BT Epoxy:  Nelco and Mitsubishi
 High CTI FR4:  Shengyi S1600
 Flexible Circuit Materials:  Dupont, Panasonic, Taiflex, Shengyi 

Surface Finishes
Electroless Nickel Immersion Gold (ENIG)
Hot Air Solder Level (HASL, Lead and Lead?free)
OSP, Immersion Tin,Immersion Silver, ENEPIG
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold
Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM
PCB TechnologiesStandardAdvanced
Rigid-Flex & Flexible CircuitsYY
Buried and Blind ViasYY
Sequential LaminationYY
Impedance Control ± 10%± 5%
Hybrids & Mixed Dielectrics YY
Aluminum PCB's YY
Non-Conductive Via Fill (VIP) YY
Conductive Via Fill YY
Cavity Boards YY
Controlled Depth Drill and RoutYY
Edge Plating YY
Buried CapacitanceYY
Etch BackYY
In-board BevelingYY
2-D Bar Code PrintingYY
Standard FeaturesStandardAdvanced
Maximum Layer Count2840
Maximum Panel Size 533x610mm [21x24"]610x1067mm [24x42"]
Outer Layer Trace/Spacing (1/3oz starting foil + platig)<90µm/90µm [0.0035"/0.0035"]64µm/76µm [0.0025"/0.003"]
Inner Layer Trace/Spacing  (Hoz inner layer cu)   76µm/76µm
Maximum PCB Thickness3.2mm [0.125"]6.5mm [0.256"]
Minimum PCB Thickness0.20mm [0.008"]0.10mm [0.004"]
Minimum Mechancial Drill Size0.20mm [0.008"]0.10mm [0.004"]
Minimum Laser Drill Size0.10mm [0.004"]0.08mm [0.003"]
Maximum PCB Aspect Ratio12:140:1
Maximum Copper Weight5 oz [178µm]6 oz [214µm]
Minimum Copper Weight1/3 oz [12µm]1/4 oz [9µm]
Minimum Core Thickness50µm [0.002"]38µm [0.0015"]
Minimum Dielectric Thickness64µm [0.0025"]38µm [0.0015"]
Minimum Pad Size Over Drill 0.46mm [0.018"]0.4mm [0.016"]
Solder Mask Registration± 50µm [0.002"]± 38µm [0.0015"]
Minimum Solder Mask Dam76µm [0.003"]64µm [0.0025"]
Copper Feature to Edge, V?cut (30°)0.40mm [0.016"]0.36mm [0.014"]
Copper Feature to PCB Edge, Routed0.25mm [0.010"]0.20mm [0.008"]
Tolerance on Overall  Dimensions ± 100µm [0.004"]±50µm [0.002"]
HDI FeaturesStandardAdvanced
Minimum Microvia Hole Size 100µm [0.004"]75µm [0.003"]
Capture Pad Size0.25mm [0.010"]0.20mm [0.008"]
Glass Reinforced DielectricsYY
Maximum Aspect Ratio0.7:11:1
Stacked MicroviasYY
Copper Filled MicroviasYY
Buried Filled ViasYY
Maximum No. of Buildup Layers5+N+5Y
Advanced Processes
Direct Imaging for Innerlayers, Outerlayers, and Soldermask
Direct Plating for High Layer Count and Microvias Products
Reverse Pulse Plating
Solid Copper Plated PTH Vias
XACT Tooling System for Improved Layer-to-Layer Registration
Spray Coating for Soldermask
Inkjet Printing for Legend
In-Line AOI for Outerlayers and AOI for Final Inspection
ORMET® Copper Paste for Any-layer Connections
ZETA® Material for HDI and Low-Loss Applications
Quality System and Certifications
IPC Specs: IPC-A-600, IPC-6012(Rigid board), IPC-6013(Flex board), IPC-6016(HDI) IPC-6018(High frequency) (Class II and Class III)
Quality System Certifications:  ISO 9001, IATF16949, ISO13485
Environmental Certifications: ISO14001, ISO/TS14067
UL Certification:  File number E332056