RF&MicroWave PCB
1
Number of Layers
1-10Layers
2
Max.Board Size
508*610mm
3
Min.Board Thickness
2-layer0.1mm
4-layer0.4mm
6-layer0.6mm
8-layer0.8mm
10-layer1.0mm
4
Min Line Width/Space
4mil/4mil(0.1/0.1mm)
5
Min.S/M Pitch
0.1mm(4mil)
6
Finish Hole (Mechanical)
0.2mm--6.30mm
7
PTH Wall Thickness
>0.025mm(1mil)
8
Hole Dia.Tolerance(PTH)
±0.075mm(3mil)
9
Hole Dia.Tolerance(NPTH)
±0.05mm(2mil)
10
Hole Position Deviation
11
Outline Tolerance
±0.10mm(4mil)
12
Twist&Bow
≤0.7%
13
Insulation Resistance
>1012Ω Normal
14
Through hole resistance
<300Ω Normal
15
Electric strength
>1.3 kv/mm
16
Current breakdown
10A
17
Peel strength
1.4N/mm
18
S/M abrasion
>6H
19
Thermal stress
288? 20 Sec
20
Test Voltage
50-300V
21
Min. blind/buried via
0.2mm (8mil)
22
Available Laminates Material
Rogers,ARLON, NELTEC, ROGERS, TACONIC
23
Finished board thickness tolerance
T>=0.8mm,Tolerance:+/-8%,T<0.8mm,Tolerance:+/-10%
24
Out Layer Copper Thickness
1oz--5oz
25
Inner Layer Copper Thickness
1/2oz--4oz
26
Aspect Ratio
8:1
27
SMT Mini. Solder Mask Width
0.08mm
28
Mini. Solder Mask Clearance
0.05mm
29
Plug Hole Diameter
0.2mm--0.60mm
30
Impedance Control Tolerance
+/-10%
31
Surface Finish
HASL,HASL Leadfree,Immersion ENIG,Chem. Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
32
Insulation Layer Thickness
0.075mm--5.00mm
33
Special technology
Impedance control PCB,Blind/Buried PCB,Hard gold PCB,Aluminum PCB
Dk level
Supplier
Type
Dk(Tolerence)
Resin/glass
UL Or not
Used
